| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM/ODM;
PCB: PCB Board;
Copper Thickness: 0.5oz 1oz 2oz 3oz;
Line Width: 0.6mm;
Thinckness: 1.6mm;
Hole: Cover with Oil;
Service: SMT Aoi DIP Aging;
Packaging: ESD Bag;
Color: Black Green Red Yellow;
Application: Set Top Box Computer;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: UC;
Layer Count: 8 Layers;
Finished Copper Thickness: All 35um;
Board Thickness: 2.0mm;
Thickness Material: Fr4;
Surface Finish: Enig;
Soldermask Color: Red;
Specialities: BGA,Controlled Impedance;
Ipc Standards: Ipc Class II;
Lead Time: 9 Working Days;
PCB Testing: E-Testing, Flying Probe Testing;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Blue;
Board Thickness: 0.8mm / 1.6mm Custom;
Custom: OEM / ODM;
Copper: 0.5oz / 18um, 2oz / 70um;
Layers: 2 Layers, 6 Layers, 8 Layers, Custom;
Legend: White;
Surface Finish: Enig / HASL;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Circuit Board Type: Rigid, Flex;
Standard: 94V0 Circuit Board;
Moisture and Dust Prevention: Conformal Coating;
Testing: Aoi, X-ray, Spi, Fct, Ict;
Programming: Support;
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Type: Rigid Circuit Board;
Dielectric: AIN;
Material: Aluminum;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: UC;
Layers: 2;
Thickness: 1.6mm;
Finised Copper Thcikness: 35um;
Size: 250*450mm;
Solder Mask Color: Black;
Surface Treatment: HASL Lead Free;
Ipc Standards: Ipc Class II;
PCB Testing: E-Testing, Flying Probe Testing;
Lead Time: 5+ Working Days;
Fast Turn: 2+ Working Days;
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