| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PCB Printed Circuit Board;
MOQ: 1 PCS;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Board Layer: 1-24 Layer;
Board Thickness: 0.2mm-4mm;
Copper Thickness: 0.5oz-6oz;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: CE, LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
PCBA Service: Printed Circuit Board PCB PCBA SMT DIP;
Other Service: PCBA/PCB Layout and Design;
Product Name: Multilayer Fr-4 Electronics 94V0 RoHS PCB;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-2;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Snt;
Structure: Power Built-in Type;
Usage: Electronic Communications, Industrial Control, Med;
Number of Switch: Multi Control Switch;
Contact Type: FPC Terminal Connector;
Detection Method: Electrical Function Test;
Function: Durable, Waterproof, Dustproof, UV Resistant;
Logo/Design: Customized;
Dimension/Shape: OEM Service;
Color: Pantone, Ral, Cmyk;
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Type: Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Material: Customized;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
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Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Board Thickness: 1.7mm;
Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
Thermal Conductivity: 3.2W/M·K (Dielectric Layer);
Copper Foil: 170μm;
Tg: 150°C;
|
Type: Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
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