| Specification |
Type: Rigid Circuit Board;
Dielectric: Rogers RO4350b;
Material: Rogers RO4350b Laminate;
Application: Cellular Base Station Antennas & Power Amplifiers;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Silver;
Base Material: Rogers RO4350b Substrate;
Insulation Materials: Rogers RO4350b Substrate;
Brand: Rogers;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mu Star;
Color: Customized;
Testing Service: Aoi/ X-ray/ Fai;
Board Thickness: 1.6mm;
Number of Layers: 1-58 Layers;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mu Star;
Color: Customized;
Testing Service: Aoi/ X-ray/ Fai;
Board Thickness: 1.6mm;
Number of Layers: 1-58 Layers;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Customized;
Item: Circuit PCBA Board;
PCB Layer: 1-28 Layers;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
PCBA Min. Chip Placement: 0201;
Turnkey Service: PCB, PCB Assembly, Box Build;
Other PCBA Service: Conformal Coating;
Applicaton: Automobile Flexible PCBA Board;
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Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Jingxin;
PCB: Green Solder Mask;
Silkscreen: White;
Copper: 1oz;
PCB Surface: Enig;
PCB Layers: 8 Layers;
PCBA: Medical Projects;
PCB Thickness: 1.6mm;
SMT: 16 Lines;
DIP: 6 Lines;
Spi: 100% Passed;
Aoi: 100% Passed;
X-ray: 100% Passed;
Programming: Yes;
Function Testing: 100% Passed;
Assembly: Yes;
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