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High Frequency PCB
US$0.99 / PCS
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What is Double-Layer 0.254mm F4btms615 RF Microwave High Frequency PCB

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 PCS US$0.99 / PCS

Sepcifications

  • Structure Double-Sided Rigid PCB
  • Dielectric F4btms615
  • Material Ceramic-Filled PTFE
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Immersion Tin
  • Production Process Subtractive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Wangling
  • Transport Package Packing
  • Specification ≤ 400mm X 500mm
  • Trademark Bicheng
  • Origin China
  • Copper Weight 1oz
  • Soldermask Color No
  • Silkscreen No
  • Layer Count 2-Layer

Product Description

Double-layer 0.254mm F4BTMS615 RF microwave high frequency PCB (All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.) 1. Overview of F4BTMS615 PCB This double-sided rigid PCB is built on F4BTMS615 - an aerospace-grade, ceramic-filled ...

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High Frequency PCB Comparison
Transaction Info
Price US$0.99 / PCS US$0.10-20.00 / Piece US$0.01-200.00 / Piece US$0.10-20.00 / Piece US$0.10-80.00 / Piece
Min Order 1 PCS 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification - - - - UL,ISO9001&ISO14001,SGS,RoHS Report
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Double-Sided Rigid PCB;
Dielectric: F4btms615;
Material: Ceramic-Filled PTFE;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Immersion Tin;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Wangling;
Copper Weight: 1oz;
Soldermask Color: No;
Silkscreen: No;
Layer Count: 2-Layer;
Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Other Material: Rogers, Pi, Al, etc;
Max Copper: 6oz;
Layer: 1L-22L;
Max Thickness: 6mm;
Finished: Enig, HASL, OSP, Lf-Hal, etc;
Structure: Double-Sided Rigid PCB;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Cooper Thickness: 2 Oz;
Board Thickness: 2.0 mm;
Materil: Metal Core;
Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Kb,Shenyi,Rogers,Iteq;
Shenzhen: China;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Layers: 1-20layers;
Enig Thickness: 1-3u'';
Hard Gold Thickness: 5-50u'';
Supplier Name

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier