| Specification |
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Automotive Tail Light FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Bohaiming;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm;
Coverlay Color: Black, White, Yellow;
Back Adhesive: High Temperature Resistant, Strong Adhesion;
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Structure: Single-Sided FPC;
Material: Polyimide+Cu;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xinhongyun;
Peel Strength Kgf/Cm: >=1.0;
Solder Flow Resistance: 300 Celsius Degree /20sec;
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Structure: Double-Sided FPC;
Material: Fiberglass;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ry;
Type: Insulation Film;
Chemistry: Organic Insulation;
Classification: Organic Insulating Material;
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Structure: Single-Sided FPC;
Material: Polyimide+Cu;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xinhongyun;
Peel Strength (Kgf/Cm): >=1.0;
Solder Flow Resistance: (After 160+_5 Celsius Degree 1 Hr) 300 Degree/20s;
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Structure: Single-Sided FPC;
Material: Polyimide+Cu;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xinhongyun;
Peel Strength (Kgf/Cm): >=1.0;
Solder Flow Resistance: (After 160+_5 Celsius Degree 1 Hr) 300 Degree/20s;
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