| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Surface Finishing: Enig 2u'';
Thickness: 2.0mm;
Mask: Green;
Silk: White;
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Structure: Multilayer Rigid PCB;
Dielectric: RO4535;
Material: Ceramic-Filled, Glass-Reinforced Hydrocarbon;
Application: Antenna;
Flame Retardant Properties: V0;
Processing Technology: Immersion Gold, Silver and Tin;
Production Process: Subtractive Process;
Base Material: RO4535;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Gold, Silver and Tin;
Laminate Thickness: 60mil 30mil 20mil;
Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB;
Dielectric Constant: 3.44;
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Structure: Multilayer Rigid PCB;
Dielectric: Diclad 880;
Material: Woven Fiberglass Reinforced, PTFE-Based Composites;
Application: Antennas Radar;
Flame Retardant Properties: V0;
Processing Technology: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Production Process: Subtractive Process;
Base Material: Diclad 880;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Laminate Thickness: 20mil 30mil 60mil;
Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB;
Solder Mask: Green, Black, Blue, Yellow, Red etc.;
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Structure: Double-Sided Rigid PCB;
Dielectric: Ad255c;
Material: Glass-Reinforced, PTFE Based Composites;
Application: Antennas;
Flame Retardant Properties: V0;
Processing Technology: Immersion Gold;
Production Process: Subtractive Process;
Base Material: Ad255c;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Gold;
Laminate Thickness: 60mil;
Layer Count: Double Sided PCB;
Final Foil External: 1.0 Oz;
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Structure: Multilayer Rigid PCB;
Dielectric: Tc600;
Material: Ceramic Filled PTFE/Woven Fiberglass;
Application: Antennas;
Flame Retardant Properties: V0;
Processing Technology: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Production Process: Subtractive Process;
Base Material: Tc600;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Laminate Thickness: 15mil 20mil 30mil 50mil 60mil;
Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB;
Solder Mask: Green, Black, Blue, Yellow, Red etc.;
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