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Abis Circuits
US$0.10-0.36 / Piece

Thru-Hole PCB Motherboard PCBA Assembly One Stop Service Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-0.36 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Em825
  • Application Automotive Electronics, Security, Digital Products
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Abis Circuits
  • Transport Package Vacuum Packaging
  • Specification FR4
  • Trademark Abis circuits
  • Origin Shenzhen, China
  • Certification UL, ISO9001&ISO14001, SGS, RoHS, IATF16949
  • Copper Thickness 4oz
  • Min Line Width/Space 0.075mm
  • Surface Finish Enig
  • Solder Mask Color Green
  • Layer 2
  • Board Thickness 2.00mm

Product Description

PCBA Capabilities 1 SMT assembly including BGA assembly 2 Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Component height: 0.2-25mm 4 Min packing: 0204 5 Min distance among BGA : 0.25-2.0mm 6 Min BGA size: 0.1-0.63mm 7 Min QFP space: 0.35mm 8 Min assembly size: (X*Y): 50*30mm 9 ...

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Abis Circuits Comparison
Transaction Info
Price US$0.10-0.36 / Piece US$0.10-0.50 / Piece US$1.00-20.00 / Piece US$1.50-10.00 / Piece US$2.00-4.50 / Piece
Min Order 1 Piece 1,000 Pieces 1 Piece 2 Pieces 2 Pieces
Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T, PayPal, Western Union T/T, PayPal, Western Union
Quality Control
Product Certification UL, ISO9001&ISO14001, SGS, RoHS, IATF16949 - - - -
Management System Certification - Others ISO9001:2015 - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe South America, Africa Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model - - ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Em825;
Application: Automotive Electronics, Security, Digital Products;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis Circuits;
Copper Thickness: 4oz;
Min Line Width/Space: 0.075mm;
Surface Finish: Enig;
Solder Mask Color: Green;
Layer: 2;
Board Thickness: 2.00mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Dunya;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hongzhou;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Chongqing Dunya Industrial Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Shenzhen New Chip international Ltd

Gold Member Audited Supplier