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Abis Circuits
US$0.10-0.20 / Piece

PCBA Supplier Circuit Board High-End PCB Assembly Android Phone PCBA Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-0.20 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Em825
  • Application Automotive Electronics, Security, Digital Products
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Abis Circuits
  • Transport Package Vacuum Packaging
  • Trademark Abis circuits
  • Origin Shenzhen, China
  • Certification UL, ISO9001&ISO14001, SGS, RoHS, IATF16949
  • Copper Thickness 2oz
  • Min Line Width/Space 0.075mm
  • Surface Finish Enig
  • Solder Mask Color Green
  • Layer 2
  • Board Thickness 2.00mm

Product Description

PCBA Capabilities 1 SMT assembly including BGA assembly 2 Accepted SMD chips: 0204, BGA, QFP, QFN, TSOP 3 Component height: 0.2-25mm 4 Min packing: 0204 5 Min distance among BGA : 0.25-2.0mm 6 Min BGA size: 0.1-0.63mm 7 Min QFP space: 0.35mm 8 Min assembly size: (X*Y): 50*30mm 9 ...

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Abis Circuits Comparison
Transaction Info
Price US$0.10-0.20 / Piece US$6.80 / Piece US$97.00 / Piece US$192.00 / Piece US$0.90-2.60 / Piece
Min Order 1 Piece 500 Pieces 500 Pieces 500 Pieces 1 Piece
Payment Terms LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification UL, ISO9001&ISO14001, SGS, RoHS, IATF16949 - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model - - - - ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Em825;
Application: Automotive Electronics, Security, Digital Products;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis Circuits;
Copper Thickness: 2oz;
Min Line Width/Space: 0.075mm;
Surface Finish: Enig;
Solder Mask Color: Green;
Layer: 2;
Board Thickness: 2.00mm;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 0.17;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 0.78;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Weight(Kg): 2.84;
Type: 94V-0 Multilayer PCB;
Dielectric: FR-4;
Material: Customized;
Application: All;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid, Fexible, Rigid and Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper, FPC, Ceramic, Aluminum-Based, High Freque;
Insulation Materials: Organic Resin;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
Surface Finishing: Asl\OSP\Immersion Gold;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

JS Technology Co., Ltd.

Diamond Member Audited Supplier