| Specification |
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.6mm;
Copper Thickness: 35um/1oz;
Surface Finish: Immersion Gold/Customized;
Solder Mask: Green;
Legend: White/Customized;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Fr4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Okey;
Color: Green, Blue, Black, Red, Yellow etc.;
Surface Finish: Lead Free HASL;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Aluminum;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Color: Green, Blue, Black, Red, Yellow etc.;
Surface Finish: Lead Free HASL;
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Structure: Metal Base Rigid PCB;
Material: Aluminium;
Production Process: Subtractive Process;
Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm;
Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K;
Ccl Brand: Jh,Ccaf.etc;
Sample Date: 3-5days;
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Structure: Single-Sided Rigid PCB;
Dielectric: Xpc;
Material: Paper/Copper Foil;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Delay Pressure Foil;
Production Process: Laminateing;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Hjh;
Sheet Thickness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: Brown;
Market: Euro, Asia, Central and South America;
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