| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Abis;
Layer: 8 Layer;
Board Thickness: 1.6mm;
Surface Finish: Enig;
Raw Material: Fr4 It180;
Inner Copper: 70um;
Outer Copper: 35um;
Solder Mask: Green;
Legend: White;
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Type: Rigid Circuit Board;
Dielectric: Rogers Rt/Duroid 6035HTC;
Material: Rt/Duroid 6035HTC;
Application: Rt/Duroid 6035HTC;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Silver;
Base Material: Rt/Duroid 6035HTC;
Insulation Materials: PTFE-Based Dielectric;
Brand: Rogers;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Circuit Board;
Dielectric: Ceramic Thermoset Polymer Composite (Rogers Tmm10);
Material: Tmm10 (25mil/0.635mm Thickness);
Application: RF/Microwave Circuitry;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Bare Copper;
Base Material: Rogers Tmm10 (Ceramic Thermoset Composite);
Insulation Materials: Thermoset Microwave Material;
Brand: Rogers;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 1-24layers;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Copper Thickness: 1oz or Custom;
Min. Hole Size: 0.15mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Board Thickness: 0.2-4mm;
Surface Finishing: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Mounting Component Pitch: 0.15mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4,Fr-1,Cem-1,Cem-3,Fr-4 Halogen Free;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manudacturer;
Layer: 1-24 Layers;
Copper Thickness: 1oz or Custom;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Board Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
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