| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.2mm;
Copper Thickness: 2oz;
Surface Finish: Immersion Gold;
Solder Mask: Green;
Legend: White/Customized;
Layer: 8 Layer;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Jc;
|
Structure: Metal Base Rigid PCB;
Material: Aluminium;
Production Process: Subtractive Process;
Insulation Materials: Organic Resin;
Board Thickness: 0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.2mm;
Thermal Conductivity: 1.0W/M.K,1.5W/M.K,2.0W/M.K,3.0W/M.K,4.0W/M.K;
Ccl Brand: Jh,Ccaf.etc;
Sample Date: 3-5days;
|
Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Printed Circuit Board;
Application: Communication;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: PCB;
Insulation Materials: Metal Composite Materials;
Brand: Tkm;
Quality: Top Quality;
Environmental Friendly: Raw Material Pass RoHS, SGS Test;
Touch Feeling: Excellent Touch Feeling;
Size: as Per Request;
|
Structure: Printed Circuit Board;
Dielectric: FR-1;
Material: Pet/PC;
Application: Aerospace;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Silk Screen Printing;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Tkm;
Quality: Top Quality;
Environmental Friendly: Raw Material Pass RoHS, SGS Test;
Life Span: Long Life with Over 1 Million Time;
Function Garantee: 100% Tested Before Shipment;
|