| Specification |
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Enig Thickness: 1-3u′′;
Hard Gold Thickness: 5-50u′′;
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Structure: DIN Power D Type;
Material: PBT;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: PBT;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: PBT;
Insulation Materials: PBT;
Brand: Antenk;
Number of Contacts: 3 to 60pins;
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Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
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Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
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Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: FPC, Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Electronic Equipment;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Custiomized;
Size: Customizable;
Thickness: 0.08-0.32mm;
Tensile Strength: ≥200 MPa;
Working Temp.: -269℃~+250℃;
Feature 1: Chemical Resistance;
Feature 2: Oil-Resistant;
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