Shenzhen Fabrication PCB Population Service Electronics Multilayer PCB Circuit Board pictures & photos

Shenzhen Fabrication PCB Population Service Electronics Multilayer PCB Circuit Board

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Price

Min. Order Reference FOB Price

1 Piece US$0.001-20.00 / Piece

Sepcifications

Structure Double-Sided Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Additive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification 265*124 mm
Trademark Abis
Origin China
Solder Color Red, Green, Black, White, Blue, Other
Surface Finish HASL, Enig, OSP, Tin, Other
Thickness 0.8mm, 0.4mm, 1.6mm, Other
Layer Thickness 0.5oz, 1oz, 1.5oz, Max 6oz

Product Description

Product Description HDI PCB Boards Sucessful Cases Show -Definition HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. They have much finer lines and spaces, smaller vias and capture pads, and higher connection pad density than ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Main Products Yes
Address Room 4113-4116, a Building, Hangcheng Intelligence Security Technology Park, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CFR, CIF, DAP, FCA
Terms of Payment LC, T/T, PayPal, Western Union
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Embroidery Electronic Device Comparison

	Shenzhen Fabrication PCB Population Service Electronics Multilayer PCB Circuit Board Contact Now	Quick View Rigid Fr4 PCB Board with Heavy Copper PCB Contact Now	Quick View High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight Contact Now	Multi-Axis Encoder Zero-Point Calibration Storage PCB with Non-Volatile Eeprom, Quadrature Edge Capture, and Index Pulse Alignment Logic Contact Now	Bluetooth HDI PCB Circuit Board with Competitive Price Contact Now

Transaction Info
	Shenzhen Fabrication PCB Population Service Electronics Multilayer PCB Circuit Board Contact Now	Quick View Rigid Fr4 PCB Board with Heavy Copper PCB Contact Now	Quick View High-Current Flexible Circuit for Drone Power Distribution and Portable Devices Thick Copper Layer (up to 4oz) Efficient Heat Dissipation Lightweight Contact Now	Multi-Axis Encoder Zero-Point Calibration Storage PCB with Non-Volatile Eeprom, Quadrature Edge Capture, and Index Pulse Alignment Logic Contact Now	Bluetooth HDI PCB Circuit Board with Competitive Price Contact Now
Price	US$0.001-20.00 / Piece	US$0.88-0.93 / piece	US$0.88-0.93 / piece	US$0.88-0.93 / piece	US$0.88-0.93 / piece
Min Order	1 Piece	1 piece	1 piece	1 piece	1 piece
Payment Terms	LC, T/T, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Double-Sided Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Additive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Solder Color: Red, Green, Black, White, Blue, Other; Surface Finish: HASL, Enig, OSP, Tin, Other; Thickness: 0.8mm, 0.4mm, 1.6mm, Other; Layer Thickness: 0.5oz, 1oz, 1.5oz, Max 6oz;	Structure: Double-Sided Rigid PCB; Dielectric: FR-3; Material: Phenolic Paper Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Fr4; Insulation Materials: Organic Resin; Brand: Fastline; Board Material: Fr4; Layers: 1 to 30 Layers; Board Thickness: 1.6mm; Copper Thickness: 1oz; Solder Mask: Green; Silk Screen: White; Surface Treatment: HASL Lead Free; Test: 100%; Lead Time: 6-8 Working Days; Min. Line Width: 0.075mm;	Structure: Double-Sided Rigid PCB; Dielectric: FR-3; Material: Phenolic Paper Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Fr4; Insulation Materials: Organic Resin; Brand: Fastline; Board Material: Fr4; Layers: 1 to 30 Layers; Board Thickness: 1.6mm; Copper Thickness: 1oz; Solder Mask: Green; Silk Screen: White; Surface Treatment: HASL Lead Free; Test: 100%; Lead Time: 6-8 Working Days; Min. Line Width: 0.075mm;	Structure: Double-Sided Rigid PCB; Dielectric: FR-3; Material: Phenolic Paper Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Fr4; Insulation Materials: Organic Resin; Brand: Fastline; Board Material: Fr4; Layers: 1 to 30 Layers; Board Thickness: 1.6mm; Copper Thickness: 1oz; Solder Mask: Green; Silk Screen: White; Surface Treatment: HASL Lead Free; Test: 100%; Lead Time: 6-8 Working Days; Min. Line Width: 0.075mm;	Structure: Double-Sided Rigid PCB; Dielectric: FR-3; Material: Phenolic Paper Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Fr4; Insulation Materials: Organic Resin; Brand: Fastline; Board Material: Fr4; Layers: 1 to 30 Layers; Board Thickness: 1.6mm; Copper Thickness: 1oz; Solder Mask: Green; Silk Screen: White; Surface Treatment: HASL Lead Free; Test: 100%; Lead Time: 6-8 Working Days; Min. Line Width: 0.075mm;
Supplier Name	Abis Circuits Co., Ltd.	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited
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Shenzhen Fabrication PCB Population Service Electronics Multilayer PCB Circuit Board

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