| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Em825;
Application: Automotive Electronics, Security, Digital Products;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis Circuits;
Copper Thickness: 4oz;
Min Line Width/Space: 0.45mm;
Surface Finish: Enig;
Solder Mask Color: Green;
Layer: 4;
Board Thickness: 1.6mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Testing Capability: Flying Probe Test, Aoi, X-ray, Ict;
Surface Finish: HASL Enig OSP Immersion Silver;
Mass Production Lead Time: 7-20days Adjusted by Product Complexity;
Customization Service: Available;
Dielectric Constant Range: 2.0-10.0 Customizable;
MOQ: 1PCS for Sample;
Max PCB Size: 400*600mm;
Copper Thickness: 1oz-5oz Customizable;
Technical Support: Support;
Impedance Control Accuracy: ±5% / ±10%;
Delivery Way: Express Delivery/Air Freight/Sea Freight;
Prototype Lead Time: 24h/48h/72h Urgent Service Optional;
Min Line Width&Space: 3.5/4mil;
Hole Copper Thickness: 20-35μm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Testing Capability: Flying Probe Test, Aoi, X-ray, Ict;
Surface Finish: HASL Enig OSP Immersion Silver;
Mass Production Lead Time: 7-20days Adjusted by Product Complexity;
Customization Service: Available;
Dielectric Constant Range: 2.0-10.0 Customizable;
MOQ: 1PCS for Sample;
Max PCB Size: 400*600mm;
Copper Thickness: 1oz-5oz Customizable;
Technical Support: Support;
Impedance Control Accuracy: ±5% / ±10%;
Delivery Way: Express Delivery/Air Freight/Sea Freight;
Prototype Lead Time: 24h/48h/72h Urgent Service Optional;
Min Line Width&Space: 3.5/4mil;
Hole Copper Thickness: 20-35μm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Testing Capability: Flying Probe Test, Aoi, X-ray, Ict;
Surface Finish: HASL Enig OSP Immersion Silver;
Mass Production Lead Time: 7-20days Adjusted by Product Complexity;
Customization Service: Available;
Dielectric Constant Range: 2.0-10.0 Customizable;
MOQ: 1PCS for Sample;
Max PCB Size: 400*600mm;
Copper Thickness: 1oz-5oz Customizable;
Technical Support: Support;
Impedance Control Accuracy: ±5% / ±10%;
Delivery Way: Express Delivery/Air Freight/Sea Freight;
Prototype Lead Time: 24h/48h/72h Urgent Service Optional;
Min Line Width&Space: 3.5/4mil;
Hole Copper Thickness: 20-35μm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Testing Capability: Flying Probe Test, Aoi, X-ray, Ict;
Surface Finish: HASL Enig OSP Immersion Silver;
Mass Production Lead Time: 7-20days Adjusted by Product Complexity;
Customization Service: Available;
Dielectric Constant Range: 2.0-10.0 Customizable;
MOQ: 1PCS for Sample;
Max PCB Size: 400*600mm;
Copper Thickness: 1oz-5oz Customizable;
Technical Support: Support;
Impedance Control Accuracy: ±5% / ±10%;
Delivery Way: Express Delivery/Air Freight/Sea Freight;
Prototype Lead Time: 24h/48h/72h Urgent Service Optional;
Min Line Width&Space: 3.5/4mil;
Hole Copper Thickness: 20-35μm;
|
