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Printing Circuit Board
US$0.01-150.00 / Piece

High Tg Fr4 Printed Circuits Board for Microwave Oven PCB Board Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-150.00 / Piece

Sepcifications

  • Structure Double-Sided Rigid PCB
  • Dielectric FR-4
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Kb
  • Transport Package Vacuum Package
  • Specification UL, ISO14001, ISO9001, SGS
  • Trademark ABIS CIRCUITS
  • Origin Made in China
  • Cooper Thickness 1oz
  • Surface Finishing HASL
  • Solder Mask Color Green
  • Silkscreen White
  • Min Line Width/Space 0.2mm/0.2mm
  • Min Hole Diameter 0.2mm
  • Finished Board Thickness 1.6 mm
  • Layer 2 Layer

Product Description

High TG FR4 Printed Circuits Board for Microwave Oven PCB Board 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, Peelable mask, 4. ...

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Printing Circuit Board Comparison
Transaction Info
Price US$0.01-150.00 / Piece US$299.00-329.00 / Piece US$199.00-229.00 / Piece US$2.70-2.90 / Piece US$299.00-329.00 / Piece
Min Order 1 Piece 10 Pieces 10 Pieces 1 Piece 10 Pieces
Payment Terms LC, T/T, PayPal, Western Union T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union T/T, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM - ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Kb;
Cooper Thickness: 1oz;
Surface Finishing: HASL;
Solder Mask Color: Green;
Silkscreen: White;
Min Line Width/Space: 0.2mm/0.2mm;
Min Hole Diameter: 0.2mm;
Finished Board Thickness: 1.6 mm;
Layer: 2 Layer;
Structure: Metal Base Rigid PCB;
Dielectric: FR-1;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: No Brand;
Machine No. 1: Hds Live 16;
Machine No. 2: Hds Gen 3 Carbon 16;
Machine No. 3: Hds Carbon 9;
Machine No. 4: Hds Gen 3 Touch 9;
Machine No. 5: Hds Gen 3 Touch 12;
Machine No. 6: Simrad Nss7 Evo2;
Machine No. 7: Simrad Nss9 Evo2;
Structure: Metal Base Rigid PCB;
Dielectric: FR-1;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: No Brand;
Machine No. 1: Hds Carbon 9;
Machine No. 2: Hds Gen 3 Touch 9;
Machine No. 3: Hds Gen 3 Touch 12;
Machine No. 4: Simrad Nss7 Evo2;
Machine No. 5: Simrad Nss9 Evo2;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Ucreate;
Layer Count: 2;
Overall Board Thickness: 2.0mm;
Surface Finish: Hot Air Leveling Lead Free;
Quantity of Couter Sink Holes: 6;
Soldermask Color: White;
Brand of White Oil: Taiyo Psr 4000-Lew3;
Lead Time: 6-7 Working Days;
PCB Testing: E-Testing, Flying Probe Testing;
Ipc Standards: Ipc Class II;
Structure: Metal Base Rigid PCB;
Dielectric: FR-1;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: No Brand;
Machine No. 1: Hds Live 7;
Machine No. 2: Hds Live 9;
Machine No. 3: Hds Live 12;
Machine No. 4: Hds Live 16;
Machine No. 5: Hds PRO 16;
Machine No. 6: Hds-7 Carbon;
Machine No. 7: Hds-9 Carbon;
Machine No. 8: Hds-12 Carbon;
Machine No. 9: Hds-16 Carbon;
Machine No. 10: Hds 9 Gen 2 Touch;
Machine No. 11: Hds 9 Gen 3 Touch;
Machine No. 12: Hds 12 Gen 2 Touch;
Machine No. 13: Hds 12 Gen 3 Touch;
Machine No. 14: Hds 8 Insight USA;
Machine No. 15: Hds-8;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Head Sun Co., Ltd.

Diamond Member Audited Supplier

Head Sun Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Head Sun Co., Ltd.

Diamond Member Audited Supplier