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Tg180 Material Rigid Pcbcircuit Board Manufacturer Multilayer Design Fr4 Rigid-Flex PCB

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

  • Structure Double-Sided Rigid PCB
  • Dielectric FR-4
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 120*130mm
  • Trademark ABIS CIRCUITS
  • Origin Shenzhen, China
  • Copper Thickness 1 Oz
  • Board Layer 2 Layers
  • Board Thickness 1.6mm
  • Surface Finish Gold Plating,Enig
  • Solder Mask Green
  • Legend White

Product Description

TG180 Material Rigid PCBCircuit Board Manufacturer Multilayer Design Fr4 Rigid-Flex PCB Product Detail Item Spec Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc Max Panel Size 600mm×1200mm Min Hole Size 0.1mm ...

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PCB Comparison
Transaction Info
Price US$0.10-10.00 / Piece US$0.35-0.60 / Piece US$0.60-1.00 / Piece US$0.80-1.00 / Piece US$1.00-1.60 / Piece
Min Order 1 Piece 1 Piece 1 Piece 2 Pieces 1 Piece
Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Copper Thickness: 1 Oz;
Board Layer: 2 Layers;
Board Thickness: 1.6mm;
Surface Finish: Gold Plating,Enig;
Solder Mask: Green;
Legend: White;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Surface Finish: Enig/1u'';
Layer: 1-24;
Base: Fr-4 (Tg110-180), Rogers, Shenyi;
Material Finished Thickness: 0.2-5.0mm;
Finished Copper Thickness: 1oz;
Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red;
PCB Testing: E-Testing, Flying Probe Testing;
Lead Time: 8 Working Days;
Fast Turn: 3 Working Days;
Structure: Multilayer Rigid PCB;
Dielectric: High Frequency;
Material: Epoxy Glass;
Application: Industrial Control;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Finished Product;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customerised;
Surface Finihsing: Immersion/ Chemical Gold 3u'';
Array Size: 260.2*215.55mm;
Min Copper Clearance: 100um;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Customerised;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Ucreate;
Board Layer: 4;
Based Material: Iteq180;
Size: 290.2*180.5mm;
Surface Finish: OSP;
Material Finished Thickness: 1.6mm;
Finished Copper: All 1oz;
Solder Mask Color: Green;
PCB Testing: E-Testing; Flying Probe Testing;
Ipc Standard: Ipc Class II;
Lead Time: 7 Working Days;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Soldermask Color: Black;
Unit Size: 50*20mm;
Finised Copper Thcikness: 70/70um;
Surface Finish: Enig/1u'';
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier