| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 1.6mm/Custom;
Copper Thickness: 35um/1oz;
Surface Finish: HASL Lead Free;
Solder Mask: Green;
Legend: White;
Layers: 4;
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Type: Rigid Circuit Board;
Dielectric: PTFE Ceramic;
Material: PTFE Ceramic;
Application: Ground Radar Warning Systems;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: OSP;
Base Material: PTFE Ceramic;
Insulation Materials: PTFE Ceramic;
Brand: Rogers;
Board Thick: 10mil (0.254mm), 25mil (0.635mm) 50mil (1.27mm), 7;
Surface Finish: Bare Copper, HASL, Enig, Immersion Tin, Immersion;
Copper Weight: 0.5oz , 1oz, 2oz;
Solder Mask: Green, Black, Blue, Yellow, Red etc;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: OSP;
Lead Time: 6-8 Working Days;
Test: Aoi X-ray;
MOQ: 1PCS;
Payment: T/T, W.U. , Paypal;
File: Gerber File, Cam, PCB;
Function: Accept Customization;
Package: Vacuum Packaging+Bubble Bag+Carton;
Service: Custom;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: FL;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: OSP;
Lead Time: 6-8 Working Days;
Tech: Buried Blind Via;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Copper Thickness: 1oz;
Surface Finishing: Enig;
Solder Mask Type: Green;
Silkscreen: White;
Board Thickness: 1.6mm;
Layer: 1 to 18;
Min. Hole Size: 0.07mm;
Min.Line Width: 0.1mm;
Min.Line Spacing: 0.1mm;
Finishing: Hal, OSP, Immersion;
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