| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V1;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Abis;
Layer: 1 Layer;
Raw Material: Fr-4, Cu Base, High Tg Fr-4, PTFE, Rogers, Teflon etc.;
Board Outline Tolerance: +0.10mm;
Impedance Control Tolerance: +/-10%;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: AIN;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: No;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1 Layer;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
Supplier: Manufacturer;
SMT Lines: 12 Lines;
Test: 100% Test;
Warranty: 12 Months;
Surface Finishments: Enig/Silver/ Golden;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: AIN;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Delay Pressure Foil;
Application: LED;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: No;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: AIN;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: No;
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