| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green / Black / Blue / Red / Yellow;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 0.5mm / 0.8mm / 1.6mm Custom;
Custom: OEM / ODM;
Copper: 0.5oz / 18um, 2oz / 70um;
Layers: 1 Layer, 2 Layers, 4 Layers, Custom;
Legend: White;
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Type: PCB;
Dielectric: 1-32 Layers;
Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid / Flex / Rigid-Fle;
Processing Technology: HASL / Enig / OSP / Immersion Silver / Tin;
Base Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Insulation Materials: Green / Black / White / Red / Blue / Yellow;
Model: PCB;
Brand: Kq;
Application: Consumer Electronics / Industrial Control / IoT /;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Surface Finishing: HASL / Enig / OSP / Immersion Silver / Tin;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Copper Thickness / Board Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Condition: New;
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Type: PCB;
Dielectric: 1-32 Layers;
Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid / Flex / Rigid-Fle;
Processing Technology: HASL / Enig / OSP / Immersion Silver / Tin;
Base Material: Fr-4/ High Tg Fr-4/Aluminum/ Ceramic/Copper/ Hal;
Insulation Materials: Green / Black / White / Red / Blue / Yellow;
Model: PCB;
Brand: Kq;
Application: Consumer Electronics / Industrial Control / IoT /;
Service: PCB Fabrication + PCBA Assembly + Components Sourc;
Surface Finishing: HASL / Enig / OSP / Immersion Silver / Tin;
Min. Hole Size / Min. Line Spacing: 0.1mm (4 Mil);
Copper Thickness / Board Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Condition: New;
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Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Product Name: HDI PCB Circuit Board;
Keywords: Printed Circuit Board;
Surface Finishing: Enig, HASL,OSP, etc;
Board Thickness: 0.6mm-4mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.3mm;
Layer Count: 0-40;
|
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Product Name: HDI PCB Circuit Board;
Keywords: Printed Circuit Board;
Surface Finishing: Enig, HASL,OSP, etc;
Board Thickness: 0.6mm-4mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.3mm;
Layer Count: 0-40;
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