| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-8mm;
Copper Thickness: 0.5-10oz;
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Type: Rigid Laminate;
Dielectric: PTFE Glass Fabric Copper-Clad Laminate;
Material: F4bme255;
Application: Microwave, RF, Radar;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Bare Copper,Electrodeposited Copper;
Base Material: F4bme255;
Insulation Materials: PTFE;
Brand: Wangling;
Board Types: Rigid Laminate;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: Rigid Laminate;
Dielectric: PTFE Glass Fabric Copper-Clad Laminate;
Material: F4bm255;
Application: Microwave, RF, Radar;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Bare Copper,Electrodeposited Copper;
Base Material: F4bm255;
Insulation Materials: PTFE;
Brand: Wangling;
Board Types: Rigid Laminate;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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Type: PCB Assembly;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: FL;
Board Material: Fr-4 (Tg 135 );
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Solder Mask: Blue;
Silk Screen: White;
Flying Probe Test: Yes;
Product Name: One Stop Service PCB Assembly PCBA;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Layer Count: 8 Layers;
Finished Copper Thickness: All 35um;
Board Thickness: 2.0mm;
Thickness Material: Fr4;
Surface Finish: Enig;
Soldermask Color: Red;
Specialities: BGA,Controlled Impedance;
PCB Testing: E-Testing, Flying Probe Testing;
Ipc Standards: Ipc Class II;
Lead Time: 9 Working Days;
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