| Specification |
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Kb;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Surface Finishing: Enig 2u'';
Solder Mask: Green;
Silk Color: Black;
Thickness: 2.0mm;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Material: Fr4;
Layers: 1 to 30 Layers;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Solder Mask: Green;
Silk Screen: White;
Surface Treatment: HASL Lead Free;
Test: 100%;
Lead Time: 6-8 Working Days;
Min. Line Width: 0.075mm;
Suppllier: Manufacturer;
SMT: 12 Lines;
Service: Fast Prototype;
Type: Multilayer;
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Structure: Multilayer Rigid PCB;
Dielectric: RO4730g3 Laminate;
Material: Ceramic Filled PTFE Composites;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Copper Weight: 0.5oz, 1oz or 2 Oz;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Layer Count: Single-Sided, Double-Sided, Multilayer, and Hybrid;
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Structure: Multilayer Rigid PCB;
Dielectric: F4btms300 Laminate;
Material: Fiberglass Cloth, Nano-Ceramic Fillers, and PTFE;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Wangling;
Copper Weight: 0.5oz, 1oz or 2 Oz;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Layer Count: Single-Sided, Double-Sided, Multilayer, and Hybrid;
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