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Turnkey Multilayer HDI PCB Board Professional PCB Board Printed Circuit Board with Gold Finger

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-100.00 / Piece

Sepcifications

  • Structure Flush Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Paper Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Additive Process
  • Base Material Copper ,PP
  • Insulation Materials Epoxy Resin
  • Brand Kb,Shenyi,Rogers,Iteq
  • Transport Package Vacuum Packing
  • Specification 70*40 mm
  • Trademark Abis
  • Origin Made in China
  • Layer 1-40 Layers
  • Raw Material Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.
  • Board Thickness 0.20mm-8.00mm
  • Board Outline Tolerance +0.10mm
  • Minimum Line/Space 0.075mm
  • Impedance Control Tolerance +/-10%
  • Surface Finish/Treatment HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger

Product Description

Turnkey Multilayer HDI PCB Board Professional PCB Board Printed Circuit Board with Gold Finger Technical &Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm ...

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PCB Board Comparison
Transaction Info
Price US$0.01-100.00 / Piece US$8.00-16.00 / sheet US$8.00-14.00 / sheet US$8.00-14.00 / sheet US$15.00-35.00 / sheet
Min Order 1 Piece 500 sheet 500 sheet 500 sheet 250 sheet
Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal LC, T/T, D/P, PayPal LC, T/T, D/P, PayPal LC, T/T, D/P, PayPal
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Southeast Asia, Africa, Western Europe North America, South America, Southeast Asia, Africa, Western Europe North America, South America, Southeast Asia, Africa, Western Europe North America, South America, Southeast Asia, Africa, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper ,PP;
Insulation Materials: Epoxy Resin;
Brand: Kb,Shenyi,Rogers,Iteq;
Layer: 1-40 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Minimum Line/Space: 0.075mm;
Impedance Control Tolerance: +/-10%;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
Structure: Single-Sided Rigid PCB;
Dielectric: FR-2;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Phenolic Paper;
Insulation Materials: Phenolic Resin;
Brand: Hjh;
Sheet Thickness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: Brown;
Market: Euro, Asia, Central and South America;
Structure: Single-Sided Rigid PCB;
Dielectric: FR-1;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Phenolic Paper;
Insulation Materials: Phenolic Resin;
Brand: Hjh;
Sheet Thickness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: Brown;
Market: Euro, Asia, Central and South America;
Structure: Single-Sided Rigid PCB;
Dielectric: Xpc;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Phenolic Paper;
Insulation Materials: Phenolic Resin;
Brand: Hjh;
Sheet Thckness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: Brown;
Market: Euro, Asia, Central and South America;
Structure: Single/Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Fiber Galss Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0, V1;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Epoxy Fiber Galss;
Insulation Materials: Epoxy Resin;
Brand: Hjh;
Sheet Thickness: 0.05-3.5mm;
Copper Thickness: 18um, 35um, 105um, Others;
Color: Yellow;
Market: Euro, Asia, Central and South America;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Haikou Haojinghui Industrial Co., Ltd.

Gold Member Audited Supplier

Haikou Haojinghui Industrial Co., Ltd.

Gold Member Audited Supplier

Haikou Haojinghui Industrial Co., Ltd.

Gold Member Audited Supplier

Haikou Haojinghui Industrial Co., Ltd.

Gold Member Audited Supplier