| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Mask: Green;
Silk: White;
Surface Finish: Immersiongold;
Layer Count: 6 Layer;
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Type: Printed Circuit Board Assembly;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Automotive;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Yuwei;
Product Name: PCB PCBA;
Keywords: Circuit Board PCBA;
Surface Finishing: Enig, Enepig, HASL,OSP, Gold Finger etc;
Board Thickness: 0.2 mm-6.5 mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.3mm;
Layer Count: 1-50;
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Type: Smart Electronics PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4/Tg/Cem-1/Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
PCB Cutting: Shear V-Score, Tab-Routed;
Min Trace/Gap: 0.075mm or 3mil;
Board Thickness: 0.2-4.0mm;
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Type: Printed Circuit Board Assembly;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industrial Control;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Brand: Yuwei;
Product Name: PCB PCBA;
Keywords: Circuit Board PCBA;
Surface Finishing: Enig, Enepig, HASL,OSP, Gold Finger etc;
Board Thickness: 0.2 mm-6.5 mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green,Red,Black,Blue,White,etc;
Silkscreen Color: White,Yellow,Black, etc;
Small Hole Size: 0.3mm;
Layer Count: 1-50;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4,Fr-1,Cem-1,Cem-3,Fr-4 Halogen Free;
Insulation Materials: Organic Resin;
Brand: Smart;
Product Name: Printed Circuit Board;
Supplier Type: Manufacturer;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Layer: 1-24 Layers;
Functional Application: PCBA;
Copper Thickness: 1oz or Custom;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Board Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
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