| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Layer: 1-20 Layers;
Raw Material: Fr4, Cu Base, High Tg Fr4, PTFE, Rogers etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Insulation Layer Thickness: 0.075mm--5.00mm;
Minimum Line/ Space: 0.075mm;
Surface Finish/Treatment: HASL, Enig, Tin, Flash Gold, OSP, Gold Finger;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Assembly Typeal: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT, DIP, Mixed SMT&DIP;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Minimum Chip Component Grade: 0201, 0402, 0603;
Min. Line/Space: Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to;
Pitch: 0.3mm Minimum BGA Pitch;
Current Carrying: Depends on Copper Weight; 1oz for Signal/Medium Po;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Assembly Typeal: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT, DIP, Mixed SMT&DIP;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Minimum Chip Component Grade: 0201, 0402, 0603;
Min. Line/Space: Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to;
Pitch: 0.3mm Minimum BGA Pitch;
Current Carrying: Depends on Copper Weight; 1oz for Signal/Medium Po;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Assembly Typeal: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT, DIP, Mixed SMT&DIP;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Minimum Chip Component Grade: 0201, 0402, 0603;
Min. Line/Space: Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to;
Pitch: 0.3mm Minimum BGA Pitch;
Current Carrying: Depends on Copper Weight; 1oz for Signal/Medium Po;
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Customization: Customized;
MOQ: 1 Piece;
Application Industry: Medical Control;
Assembly Typeal: Tinned Copper Bare Copper;
Surface Finish: Lead Free HASL;
Assembly Type: SMT, DIP, Mixed SMT&DIP;
Component Sourcing: Factory Sourcing;
Firmware Programming: Supported;
Certifications: ISO9001, IATF16949, ISO13485, CE, RoHS;
Lead Time: 2 to 5 Days for Samples, 7 To15 Days for Mass;
Minimum Chip Component Grade: 0201, 0402, 0603;
Min. Line/Space: Standard 0.15mm/0.15mm (6mil); Fine Pitch Down to;
Pitch: 0.3mm Minimum BGA Pitch;
Current Carrying: Depends on Copper Weight; 1oz for Signal/Medium Po;
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