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PCB Board
US$0.10 / Piece

6 Layers Immersion Gold PCB Board with Competitive Price Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Paper Phenolic Copper Foil Substrate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Kb
  • Transport Package Vacuum Package
  • Specification UL, ISO14001, ISO9001, SGS
  • Trademark ABIS CIRCUITS
  • Origin Made in China
  • Cooper Thickness 1oz
  • Surface Finishing Immersion Gold 2u''
  • Solder Mask Color Green
  • Silkscreen White
  • Min Line Width/Space 0.2mm/0.25mm
  • Min Hole Diameter 0.2mm
  • Finished Board Thickness 1.6 mm

Product Description

6 Layers Immersion Gold PCB Board with Competitive Price 1. Single, Double side &Multi-layer PCB. 2. Buried/Blind Vias, Via in Pad, Counter Sink Hole, Screw Hole(Counterbore), Press-fit, Half Hole. 3. HASL lead-free, Immersion Gold/ Silver/Tin, OSP, Gold plating/finger, Peelable mask, 4. ...

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PCB Board Comparison
Transaction Info
Price US$0.10 / Piece US$1.00 / Piece US$1.00 / Piece US$1.00 / Piece US$1.00 / Piece
Min Order 1 Piece 1,000 Pieces 1,000 Pieces 1,000 Pieces 1,000 Pieces
Payment Terms LC, T/T, PayPal, Western Union LC, T/T, Western Union LC, T/T, Western Union LC, T/T, Western Union LC, T/T, Western Union
Quality Control
Product Certification - RoHS RoHS RoHS RoHS
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa
Annual Export Revenue - - - - -
Business Model - OEM OEM OEM OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Kb;
Cooper Thickness: 1oz;
Surface Finishing: Immersion Gold 2u'';
Solder Mask Color: Green;
Silkscreen: White;
Min Line Width/Space: 0.2mm/0.25mm;
Min Hole Diameter: 0.2mm;
Finished Board Thickness: 1.6 mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thicknes: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thicknes: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thicknes: 0.35mm;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier