| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green / Black / Blue;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 1.6mm / 2.0mm / Custom;
Custom: OEM;
Copper: 1oz / 1.5oz;
Surface Finish: Enig / HASL / L-F HASL;
Layers: 2 Layers;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: OEM;
Surface Treatment: Gold Finger/Hard Gold;
Layers: 1-36layers;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-12oz(18-420um);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Hole Diameter: Min0.05mm;
Min.Line Width: 0.10mm(4mil);
Min.Line Spaceing: 0.10mm(4mil);
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Max.Finished Board Side: 1020mm*1000mm;
MOQ: No;
Sample Date: 5-7days;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Layer: up to 32 Layers;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, etc;
PCB Type: Rigid PCB, Flexible PCB, Rigid- Flexible PCB;
PCB Shape: Any Shape;
Board Thickness: 0.3mm-4mm;
Max.Finished Board Size: 500* 1200mm;
Min.Drilled Hole Size: 0.2mm;
Min.Line Width: 0.05mm(2mil);
Min.Line Spaceing: 0.05mm(2mil);
Copper Thickness: 1/20z, 10z, 20z, 30z;
Hole Tolerance: Pth:±0.076, Ntph: ±0.05;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Materials: Fr4/ Al/ FPC/ Cem-1/ Cem-3/ 94V0/ Rogers;
PCB Layer: 1-32 Layers;
PCB Thickness: 1.6mm-3.2mm/ 0.2mm-1.2mm;
Copper: 18um-210um(6oz);
Surface Treatment: HASL/ Enig/ Lf-Hal/ Immersion T;
Gerber File Format: .PCB / .P-CAD / .Dx;
Solder Mask: Green/White/Black/Red/Purple/ Blue/Brown;
Sample L/T: 5 to 7work Days;
Standare: Ipc-160-2;
Certificates: ISO9001, ISO13485, IATF16949;
MOQ: 1;
Component Range: 01005, BGA, Flip Chips, Connectors;
Quality Control: Fly-Probe Testing,Aoi, X-ray, Ict Testing;
EMS Service: PCB Design, PCB Clone, PCB Layout, PCB Assembly;
PCBA Packaging: Bubble Bag, ESD, Vacuum Packing;
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