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Printed Circuit Board
US$0.10-7.00 / Piece
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What is Single PCB Board Assembly Fr4 Cem-3 Pi Enig OSP HASL-L F

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-7.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Flame Retardant Properties V0
  • Dielectric FR-4
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Processing Technology Electrolytic Foil
  • Application Aerospace
  • Mechanical Rigid Rigid
  • Material Fiberglass Epoxy
  • Brand Abis
  • Transport Package Vacuum Packing
  • Specification 90mm*110mm
  • Origin China
  • Test Flying Probe and Fixture
  • Solder Mask Green
  • Board Thickness 1.6mm Custom
  • Custom OEM / ODM
  • Copper 1oz / 35um
  • Layers 1layer
  • Legend White
  • Surface Finish L-F HASL

Product Description

Single PCB Board Assembly FR4 CEM-3 PI ENIG OSP HASL-L F Technical &Capability Layers 1~20 Board Thickness 0.1mm-8.0mm Material FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base, etc Max Panel Size 600mm×1200mm Min Hole Size 0.1mm Min Line Width/Space 3mil(0.075mm) ...

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Printed Circuit Board Comparison
Transaction Info
Price US$0.10-7.00 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, PayPal, Western Union T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
Quality Control
Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green;
Board Thickness: 1.6mm Custom;
Custom: OEM / ODM;
Copper: 1oz / 35um;
Layers: 1layer;
Legend: White;
Surface Finish: L-F HASL;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 1060 Core (1.4mm);
Thermal Conductivity: 3W/M·K (Dielectric Layer);
Copper Foil: 35μm;
Tg: 130°c;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 1060 Core (1.4mm);
Thermal Conductivity: 3W/M·K (Dielectric Layer);
Copper Foil: 35μm;
Tg: 130°c;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 1060 Core (1.4mm);
Thermal Conductivity: 3W/M·K (Dielectric Layer);
Copper Foil: 35μm;
Tg: 130°c;
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: Customized;
Dielectric: MCPCB\Fr4\Bt;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Processing Technology: Delay Pressure Foil;
Application: New Energy Vehicle Electronic Control Board;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 1060 Core (1.4mm);
Thermal Conductivity: 3W/M·K (Dielectric Layer);
Copper Foil: 35μm;
Tg: 130°c;
Supplier Name

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier