| Specification |
Type: Metal Core PCB;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Abis;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
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Type: Combining Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Fexible;
Material: Aluminum;
Brand: PCB PCBA;
Item: PCB Plastic Case LED Strip Flexible PCB Tda7294 Am;
Layer: 1-22;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 3 Mil;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
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Type: Flexible Circuit Board;
Flame Retardant Properties: HB;
Dielectric: AIN;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Fexible;
Material: Synthetic Fiber;
Brand: Xyt;
Power Supply: 24VDC;
Output: 4-20mA;
Temperature Range: (-40~130)℃;
Constant Current Incentive: (50 ~750)μ a;
Constant Voltage Incentive: 4VDC;
Temperature Drift Performance: 10ppm;
Magnification: 1 ~ 256 Times;
Dac: 16-Bit;
Response Rate: (5~2400)Hz;
ADC: 24-Bit;
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Type: Combining Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Circuit Board Type: Rigid, Flex;
Standard: 94V0 Circuit Board;
Moisture and Dust Prevention: Conformal Coating;
Testing: Aoi, X-ray, Spi, Fct, Ict;
Programming: Support;
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Type: Combining Rigid Circuit Board;
Flame Retardant Properties: V2;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Circuit Board Type: Rigid, Flex;
Standard: 94V0 Circuit Board;
Moisture and Dust Prevention: Conformal Coating;
Testing: Aoi, X-ray, Spi, Fct, Ict;
Programming: Support;
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