| Specification |
Structure: Single-Sided FPC;
Material: Copper;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Camera Lens;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Flex Plus;
Copper Thickness: 1/3 Oz ~2 Oz;
Length: Max. 4m (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Membrane Switch;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Crypcb;
Assembly Type: FPC, Rigid-Flex PCB;
Through-Hole Tolerance: ± 0.05 mm;
Customization: Available;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pl, Copper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min.Hole Size: 0.15mm;
Min. Line Spacing: 0.075mm;
Min.Line Width: 0.075mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Board Thickness: 0.057 to 0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pl, Copper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min.Hole Size: 0.15mm;
Min. Line Spacing: 0.075mm;
Min.Line Width: 0.075mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Board Thickness: 0.057 to 0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
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Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Fr4 + Polyimide;
Insulation Materials: Organic Resin;
Brand: Yuwei;
Product Name: Multilayer PCB;
Surface Finishing: Enig, HASL, OSP, Enepig, Gold Finger etc;
Board Thickness: 0.25mm-0.6mm;
Copper Thickness: 18um-175um;
Solder Mask Color: Green, Red, Black, Blue, White, etc;
Silkscreen Color: White, Yellow, Black, etc;
Small Hole Size: 0.15mm;
Layer Count: 1-24 L;
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