| Specification |
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Copper;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Flex Plus;
Copper Thickness: Max 5oz;
Length: Max. 4m (XL Exposure Machine);
Line Width: Min 0.05mm;
Color: Yellow;
Sample Delivery: 3~5days;
MP Delivery: 7~10days;
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Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: PP,Copper;
Insulation Materials: Epoxy Resin;
Brand: Kb,Shenyi,Rogers,Iteq;
Layer: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Minimum Line/ Space: 0.075mm;
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Structure: Double-Sided Rigid PCB;
Dielectric: RO4533;
Material: Ceramic-Filled, Glass-Reinforced Hydrocarbon;
Application: Antenna;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Gold;
Laminate Thickness: 60mil;
Layer Count: Double Sided PCB;
Dielectric Constant: 3.3;
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Structure: Multilayer Rigid PCB;
Dielectric: Rt Duroid 5880lz;
Material: Unique Filled PTFE Composites;
Application: Stripline and Microstrip;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Laminate Thickness: 10mil 20mil 50mil and 100mil;
Layer Count: Single Sided, Double Sided, Multilayer PCB, Hybrid;
Dielectric Constant: 2;
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Structure: Multilayer Rigid PCB;
Dielectric: RO4533;
Material: Ceramic-Filled, Glass-Reinforced Hydrocarbon;
Application: Antenna;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Solder Mask: Green, Black, Blue, Yellow, Red etc.;
Laminate Thickness: 20mil 30mil 60mil;
Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB;
Dielectric Constant: 3.3;
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