Basic Info.
Model NO.
COMe_TYPE6_RK3588-V2.2
Structure
Single-Sided Rigid PCB
Material
Epoxide Woven Glass Fabric Laminate
Application
Industrial Control
Flame Retardant Properties
V0
Processing Technology
Electrolytic Foil
Production Process
Subtractive Process
Base Material
Copper-Clad Laminate, Ccl
Insulation Materials
Epoxy Resin
Transport Package
Shock-Absorbing Buffer Packaging
Specification
95*95*8.1mm
Product Description
Product Overview
The COMe_TYPE6_RK3588-V2.2 Single Board Computer is an industrial FPGA computing board for advanced control & processing. Designed for high-reliability scenarios such as industrial automation and rail transportation, this COM Express Type6 embedded board integrates the RK3588 ARM SOC and XC7A50T FPGA to achieve seamless collaboration between high-performance computing and hardware acceleration. Fully compliant with COM.0 R2.1 Type 6 and measuring just 95 × 95 mm, it allows direct replacement of x86 COMe modules without carrier redesign. Supporting operation from -40°C to 85°C and featuring rich interfaces including PCIe3.0, SATA3.0, MIPI, CAN, GTP, it provides a flexible and stable hardware platform for industrial control, machine vision, data acquisition, and more.
Key Features
1. COM Express Type6 Drop-in Compatibility
Strictly compliant with the <COM Express Module Base Specification COM.0 R2.1> Type6 standard and seamlessly replace X86 COMe modules.
2. Compact Structure 95x95mm:
Adheres to COM Express Compact specifications, ideal for space-constrained industrial PCs and edge computing devices.
3. ARM+FPGA Heterogeneous Computing Architecture:
High-speed interconnection between the RK3588 ARM SOC and Xilinx FPGA via PCIe 2.0, UART, and I2C, ensures real-time control and large-scale data transmission.
4. Comprehensive Interfaces of the computing board:
Standard Interfaces: Gigabit Ethernet, SATA 3.0, USB 3.0, HDMI 2.1, MIPI DSI/CSI/CAN. Extended Interfaces: GTP, LVDS (FPGA-driven)
5. Wide-Temperature Operation:
Dual versions available: -20°C to 70°C and -40°C to 85°C(rugged industrial-grade), tailored for demanding environments like power systems and rail transportation.
6. Low-Power Consumption:
Typical power consumption of 10W-15W, combining the RK3588J SOC, LPDDR4 16GB, and FPGA for high-performance efficiency.
Dual core heterogeneous architecture
ARM Side: Rockchip RK3588 (4×Cortex-A76 + 4×Cortex-A55) with LPDDR4 (up to 32GB) and eMMC 5.1 (up to 256GB)
FPGA Side: Xilinx Artix-7 XC7A50T-2FGG484I (Upgradable to XC7A100T) with MT25QL256ABA1EW7 SPI Flash for bitstream storage
| Core Components | Interface & Compatibility |
| Front Side | Back Side | Standard Interfaces | Industrial Protocols |
RK3588 SoC LPDDR4 CXDB5CCAM-MK XC7A50T- 2FGG484I FPGARK806-1 PMIC | GM8775C MIPI-LVDS x2 YT8531SH GbE PHY x2 MT25QL256 SPI Flash DDR3 MT41K256M16TW-107IT:P | 2×GbE (YT8531SH PHY) 4×USB 3.0 DMI 2.1 + DP 1.4 | SRIO, Aurora, CAN 2.0B RS485 with surge protection FPGA GPIO (Isolation design) |
Industrial grade signal integrity
Display Flexibility:
2×HDMI, 1×DP, 1×MIPI-DSI, 1×LVDS (via GM8775C), 5 independent outputs for simultaneous multi-display control
Network Reliability:
Dual YT8531SH Gigabit Ethernet PHY, equipped with industrial grade EMC protection
Technical Specifications
| COMe_TYPE6_RK3588 |
| ITEM | DESCRIPTION |
| CPU | RK3588/RK3588J;8nm;64bit |
| 4xARM Cortex-A76 RK3588 : 2.4GHz RK3588J:1.6GHz;CAN UP TO 2.0GHz |
| 4xARM Cortex-A55 RK3588 : 1.8GHz RK3588J: 1.3GHz;CAN UP TO 1.7GHz |
| 3xARM Cortex-M0(PMU_M0,NPU_M0,DDR_M0) PMU_M0: 200MHz NPU_M0;DDR_M0 UNOPEN |
| NPU: 6TOPS SUPPORT:INT4/INT8/INT16/FP16/BF16/TF32 SUPPORT:TensorFlow/PyTorch/Caffe/MXNet |
| GPU: Mali-G610 MP4 SUPPORT: OpenGL ES 1.1/2.0/3.2;OpenCL 2.2;Vulkan 1.2 |
ISP: 2xISP(ISP0/ISP1);support HDR;3DNR; SUPPORT CAMERA: 48M: 8064×6048@15fps dual ISP 32M:6528×4898@30fps dual ISP 16M: 4672×3504@30fps single ISP |
| DECODER:8K@60fps H.265,8K@30fps H.264 |
| ENCODER: 8K@30fps H.265/H.264 |
| ROM:32/64/128GByte eMMC |
| RAM:4/8/16GByte LPDDR4X |
| GBE:2x |
| SATA:1xSATA3.0 |
| PCIe:1xPCIe 3.0×4/4xPCIe 3.0×1;1xPCIe 2.1×1 |
| USB:1xType-C(USB3.0);1xUSB3.0;2xUSB2.0 |
| Video OUT:1xMIPI DSI(DCPHY 4LANE);1xLVDS(MIPI TO LVDS); 1xHDMI OUT;1xDP |
| Video IN:1xMIPI CSI(DPHY);1xHDMI IN |
| SPI:x1 |
| I2S:x1 |
| SARADC:x3 |
| UART:x2 |
| I2C:x2 |
| GPIO:x5 |
| FPGA | XC7A50T-2FGG484I |
| Logic Cells:52160 |
CLBs Slices:8150 Max Distributed RAM(Kb):600 |
| DSP48E1 Slices:120 |
Block RAM Blocks 18 Kb:150 36 Kb:75 Max(Kb)2700 |
| CMTs:5 |
| PCIe:1 |
| GTPs:4(ONE FOR PCIe2.0 WITH RK3588;THREE FOR OUT) |
| Max User:250 |
| ROM:256Mbit QSPI FLASH |
| RAM:1GByte DDR3 |
| IO:36(3.3V BANK14);30(3.3V BANK15);6(2.5V BANK16) |
| LVDS:16 PAIRS(BANK16)/(32 IO 2.5V) |
| MCU | PY32F002BF15U6TR;32bit |
| Cortex-M0;24MHz |
| 24KByte FLASH |
| 3KByte SRAM |
| IO:x18 |
| CPU TO FPGA | I2C:x3 |
| UART:x2 |
| GPIO:7 |
| PCIe2.0:X1 |
| LED | 5x |
| INTERFACE | B2B CONNECTOR;COMe Type6;440PIN |
| POWER | 12V±5%;5V±5%; |
| SIZE | 95*95*8.1MM |
| SOFTWARE | Debian 11(Linux-5.10.160) |
| Buildroot-2021.11(Linux-5.10.160) |
| Ubuntu20.04(Linux-5.10.160 XFCE) |
| Qt-5.15.10 |
| Required lib and drive |
Application Scenarios
Mission-Critical Control with Precision Timing
Scenario: Railway Signal System
Technical Analysis:
FPGA achieves real-time acquisition of track signals through isolated GPIO
Dual YT8531SH PHY supports hot redundant network communication
GM8775C driver LVDS display screen presents scheduling information
Configuration OptionsStandard version basic configuration:RK3588 ARM processor | 8GB LPDDR4 | 32GB eMMC | XC7A50T FPGAFlexible upgrade options (price adjustment for changing configurations, please contact sales for details):1. Processor: RK3588 → RK3588J (industrial grade chip)
2. Memory: 8GB → 12GB/32GB (maximum supported)
3. Storage: 32GB → 64GB/128GB/256GB eMMC
4. FPGA: XC7A50T (basic) → XC7A100T (doubling logical resources)
(Note: All configurations maintain 100% mechanical compatibility with COM ExpressType 6)Why Choose Us?Provide one-stop R&D services from schematic design to hardware delivery: based on Xilinx FPGA, Rockchip ARM, TI DSP and other platforms, focusing on high-speed digital circuit research and development and complex architecture design for 10 years; Support 2-20 layers of PCB and blind buried hole technology, with daily delivery of 400PIN; Integrate material procurement, precision welding, and debugging, with a rapid response time of 72 hours. With industrial grade high reliability standards (defect rate ≤ 0.1%), we assist customers in industrial control, new energy, intelligent equipment and other fields to accelerate product implementation.
Address:
Room 408-3, Research Bldg, No. 229 Tongzipo W Rd, Changsha High-Tech Development Zone, Changsha, Hunan, China
Business Type:
Manufacturer/Factory
Business Range:
Computer Products, Electrical & Electronics, Industrial Equipment & Components
Company Introduction:
Changsha Wayne Technology Co., Ltd.
Industrial Motherboard Design & Full-Customization Services ISO 9001 Certified MOQ 1 Piece
Wayntech (Beijing HQ founded in 2015 / Changsha branch established in 2022) is a technology-based enterprise focusing on hardware innovation and technical services. With a core R&D team boasting 20 years of hardware expertise, we focus on industrial-grade motherboard development based on ARM (Rockchip RK3588/NXP I. MX8MP), FPGA (Xilinx full series), and DSP (TI C6000) architectures, delivering high-reliability hardware solutions for industrial automation, smart devices, communication equipment and more.
Core Advantages
Full-Temperature Stability: Commercial-grade (-20~70° C) and industrial-grade (-40~80° C or even -40~125° C) designs for harsh environments;
End-to-End Customization: Requirement analysis → Schematic/PCB design → Prototype testing → Mass production, with 15-day rapid prototyping;
High-Speed Interface Compatibility: Supports PCIe Gen3, GBE, CAN, USB3.0, and custom SRIO bus designs;
Quality Assurance: ISO 9001 certified, EMC test validation (with reports), and <0.3% defect rate.
Client Benefits
Flexible Response: MOQ 1 piece, cost-effective solutions tailored for small and medium-sized enterprises;
Hassle-Free Delivery: Provides turnkey services including BOM lists and mass production documentation;
Long-Term Partnership: Free hardware adaptation consultancy, helping 300+ clients slash 50% R&D cycles.
Our vision: To be the technical partner for global industrial hardware innovation, ensuring every motherboard serves as the "reliable core" of our clients' product.