Miss Han
Sales
Marketing Department
Address:
Lidu Industrial Park, Chongqing, China
Telephone:
Zip Code:
Fax:
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Account Registered in:
2013
Business Range:
Electrical & Electronics
Management System Certification:
ISO 9000, ISO 14000, EICC
Business Type:
Manufacturer/Factory
Main Products:
BGA Solder Ball, Lead-Free Solder Wire, Cu Core Solder Ball, Cu Wrap Column, Micro-Coil Spring, Nano AG-Cu Solder Paste, Plastic Core Solder Ball, Reinforced Structure Sac305 Solder Paste, Anode Ball, Low Alpha Solder Ball
Company Introduction
Trade Capacity
Production Capacity
Chongqing Qunwin Electronic Materials Co., Ltd. Is a Taiwan-funded enterprise, it combines experts and professional skills, with a total investment amount of $30 million and a registered capital amount of $30 million.
Our company specialized in researching, producing and selling semiconductor and SMT encapsulation application-specific BGA solder, electroplating solder, solder paste, tin, flux ...
Our company specialized in researching, producing and selling semiconductor and SMT encapsulation application-specific BGA solder, electroplating solder, solder paste, tin, flux ...
Chongqing Qunwin Electronic Materials Co., Ltd. Is a Taiwan-funded enterprise, it combines experts and professional skills, with a total investment amount of $30 million and a registered capital amount of $30 million.
Our company specialized in researching, producing and selling semiconductor and SMT encapsulation application-specific BGA solder, electroplating solder, solder paste, tin, flux etc. We own many items of patented technology, and hold the patented technology of Taiwan and China atomization forming BGA solder.
Our finished products project had been listed into 100 technological innovation projects in 2008 by Chongqing economic committee, and placed in 11th. Products are up to standard of JIS Z3282, and we have been authorized by US. HENKEL CORPORA TION and JOHSON MANUFACTURNG COMPANY together with US. IOW university research fund. All products are SGS certificated.
Our company specialized in researching, producing and selling semiconductor and SMT encapsulation application-specific BGA solder, electroplating solder, solder paste, tin, flux etc. We own many items of patented technology, and hold the patented technology of Taiwan and China atomization forming BGA solder.
Our finished products project had been listed into 100 technological innovation projects in 2008 by Chongqing economic committee, and placed in 11th. Products are up to standard of JIS Z3282, and we have been authorized by US. HENKEL CORPORA TION and JOHSON MANUFACTURNG COMPANY together with US. IOW university research fund. All products are SGS certificated.
International Commercial Terms(Incoterms):
FOB
Terms of Payment:
T/T, PayPal
Average Lead Time:
Peak Season Lead Time: 1-3 months, Off Season Lead Time: one month
Number of Foreign Trading Staff:
4~10 People
Export Year:
2020-06-05
Export Percentage:
11%~20%
Main Markets:
North America, Oceania, Western Europe
Nearest Port:
chengdu
Import & Export Mode:
Exportation via agency
Factory Address:
Lidu Industrial Park, Chongqing, China
R&D Capacity:
OEM
No. of R&D Staff:
11-20 People
No. of Production Lines:
5
Annual Output Value:
US$10 Million - US$50 Million