Product information
Specification:10m2/roll(250mm+3mm*40m)
Weight: 3kg/Carton
Carton size: 63*42*35cm
The PIC-PL series aredesigned to be used for the latest high-precision LDI (Laser Direct Imaging)and UV-LED types of UV-exposure equipment which typical operates on 365-nmsingle wave-length UV light.Thespecially selected photo-initiator in the product gives it excellentphoto-sensitivity toward 365-nm UV light.Typically, a UV dosage of 100-200 mJ/cm² is sufficient for thesatisfactory result.On the other hand,the PL series can also be used for the more conventional 7-kW or even 5-kWmercury-lamp types of UV-exposure equipment.Due to the much higher photo-sensitivity of this product, exposure timecan be significantly shorted.
The advantages of thisproduct are:
1.Easy lamination - lamination can be carried outusing low-temperature air-bag vacuum-type quick-laminator commonly used in FPCBstiffener attachment.
2.The base release film is removed beforeUV-exposure.This allows higherprecision patterning.
3.High photo-sensitivity, fast developing.
4.Low-temperature curing -135°C x 120 min; or150°C x 60 min
5.Good flexibility - It can tolerate 180°-bending withoutfracturing.
Over-cure should be avoidedas prolonged heating can cause oxidation of the copper surface, leading topeeling of the coating during the
immersion gold (ENIG) process.
Thin FPCB substrate withcured PIC can run into the problem of curling.Generally, the 3-layer substrate tends to be more problematic than the2-layer substrate.To overcome thisproblem, these approaches should be considered:
1.Use thinner PIC film to reduce residual contractionforce which causes substrate to curl up in the PIC-direction.
2.Use low-temperature post-cure: 135°C x120 min.
It is also excellent as thedielectric material for photo-via process.
It meets RoHS &halogen-free specifications.
Specifications
| Item | Unit | PLY20 /PLG20 | PLY25 /PLG25 PLC25/ PLW25 | PLY38 /PLG38 PLC38 /PLW38 | PLY50 /PLG50 |
| Color | / | Yellow/Green | Yellow/Green
Black/White | Yellow/Green
Black/White | Yellow/Green |
| Thickness | µm | 20 | 25 | 38 | 50 |
| Pneumatic vacuum quick- presstemperature | °C | 55-60 | 55-60 | 55-60 | 55-60 |
| Duration of vacuum | s | 5~10 | 5~10 | 5~10 | 5~10 |
| Pressure | Kg/cm² | 15-21 | 15-21 | 15-21 | 15-21 |
| Bonding time | s | 10~30 | 10~30 | 10~30 | 10~30 |
| sensitivity@ 100 mJ/cm² @ 365 nm-UV | 21-step Stf. photo-guide | 11±2 | 12±2 | 12±2 | 13±2 |
| Developing time(s) | 1% Na2CO3 x 1.2 kg/cm² nozzle | 30 | 40 | 60 | 90 |
| Post cure | °C | 135°C x 120mins,or 150°C x 60mins |
| Storage | Keep out of the sun | 12 months @ -10°C;6 months @ 4°C;6 days @ 25°C |
Physical property
| Testing | Result | Method |
| Pencil Hardness | >=3H | IPLC-TM-650 2.4.27.2 |
| Flexibility | Pass | PLC-TM-650 2.4.5.1 10 cycles with 3 mm mandrel |
| Resistance to Ni/Au process | Pass | Ni = 150 m; Au = 3 m No splitting, delaminating, or other adverse effects |
| Resistance to Solder | Pass | IPLC-TM-650 2.4.28.1C No splitting, delaminating, or other adverse effects |
| Tg | 65°C | TMA - TA Instrument Q400 Equilibrate @ 30°C; ramp up @ 10°C/min to 200°C |
| CTE - Coefficient of Thermal Expansion | 64 µm / m·°C | TMA: 30-45°C |
| CTE - Coefficient of Thermal Expansion | 257 µm / m·°C | TMA: 110-180°C |
| Tg | 64°C | DSC -TA Instrument Q20 Equilibrate @ 30°C; ramp up @ 20°C/min to 150°C |
| Tg | 103°C | DMA -TA Instrument 2980 Equilibrate @ 35°C; ramp up @ 5°C/min to 200°C |
| Td (5% weight loss) | 300°C | TGA -TA Instrument Q50 |
| Moisture Absorption | 0.40% | IPLC TM-650-2.6.2C |
| Young`s Modulus | 510 MPa | TA Instrument - Universal V4.1D |
| Tensile Strength | 59 MPa | TA Instrument - Universal V4.1D |
| Elongation | 3.70% | TA Instrument - Universal V4.1D |
| Surface Resistivity | 3.2x1014Ω.cm | HP High Resistance Meter HP4339A |
| Volume Resistivity | 3.2x1015Ω.cm | HP High Resistance Meter HP 4339A |
Dk (Dielectric Constant) & Df (Dissipation Factor)
NetworkAnalyzer (Agilent N5230A)
| | 2 GHz | 3 GHz | 5 GHz | 10 GHz |
| Dk | 3.19 | 3.16 | 3.12 | 3.07 |
| Df | 0.023 | 0.021 | 0.021 | 0.02 |
