Product information
Base materia FR4, Tg FR4, halogen free material, orgers HF material, alumium base etc Surface finish Hal LED free hal, Immersion godld, OSP, Immersion tin ect
Layer 1-10 layer Min line width 3 Mil
Copper Thicknes 0.5-6 OZ Min line spacing 3 Mil
Board thickness 0.2-6MM Mounted manner SMT and DIP
Min hole size 0.1mm Wrap and twist <=0.7%
Flammability 94V-0

Our advantage
One stop service for PCB design, PCB layout, PCB manufactory, Component purchasing, PCB assembly, Test, packing and PCB delivery
1, Full SMT, DIP hybrid PCB assembly capacity to finish product to customer
2, Experienced QC and Inspector
3, Strong source ability in relative parts and component
4, Experience Technical engineers in charge of products design.
5, Circuit boards 1 to 28m layers PCB layout, fabrication, PCB assembly and box build
6, Enclosure cabinet case plastic injection molding, metal stamping, manufacturing and assembly
7, High Precision0201 size components STM technology and leed free.
8, RoHS compliant SMT DIP process
9, IC pre-program
10, High precision E-testing Included: ICTin circuit, function test, etc.

PCB assembly capabilities
Quantity: Prototype & Low volume, , medium volume, big volume
Type of assembly SMT, DIP
Components Passive down to 0201 size; Double sided SMT assembly, Fine pitch to 0.8mil
Bare board size Smallest: 0.25*0.25", Largest: 20*20"
File formate Bill of materials; Gerber files; Pick-n-place file
Type of service Turn-key, tube, reel, loose parts
Component packaging Cut tape, tube reels, loose parts

Test
AOI Testing: In Circuit testing:
1, Check solder paste Power-up Test
2, Check components down to 0201" Advanced function test
Check missing components, offset, incorrect parts, polari Flash device programming
Functional testing