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Mr. Lina
Address:
Address, Tangshan, Hebei, China
Telephone:
Zip Code:
Fax:
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Account Registered in:
2023
Business Range:
Consumer Electronics, Industrial Equipment & Components, Manufacturing & Processing Machinery
Management System Certification:
ISO 9001, ISO 9000, ISO 14001, ISO 14000
Business Type:
Manufacturer/Factory
Company Introduction
Trade Capacity
Production Capacity
Chengliankaida (Hebei)Technology Co., Ltd was founded in 2007 with its headquarters in Tongzhou district, Beijing, covering an area of 20000 square meters. With the company's fast development, in early 2023, our Zunhua factory was put into operation and covers an area of 35000 square meters.
As a high-tech enterprise, we focus on researching and developing a series of Vacuum soldering system ...
As a high-tech enterprise, we focus on researching and developing a series of Vacuum soldering system ...
Chengliankaida (Hebei)Technology Co., Ltd was founded in 2007 with its headquarters in Tongzhou district, Beijing, covering an area of 20000 square meters. With the company's fast development, in early 2023, our Zunhua factory was put into operation and covers an area of 35000 square meters.
As a high-tech enterprise, we focus on researching and developing a series of Vacuum soldering system solution and production lines for semiconductor electronic device packaging. We adhere to the core concept of "Innovation&Intelligence&Creativity, &Responsibility" guides us to study domestic and foreign advanced experiences, fully research and development the soldering technology to solve problems of high void rate and hermetic packaging and so on. With more and more customers using our equipment, we getting more high praise from the users.
At the same time, we also established a research and development center with the IGBT industry alliance and various universities and institutes committed to the development of the packaging of power module devices and semiconductor electronic devices. We have achieved a series of accomplishments, including 15 practical patents, software patents, design patents, and currently, more than 25 patents are in the process of being applied for. We will continue to innovate, constantly upgrade our products, increase technology and process development, and strive to become an internationally renowned equipment enterprise.
As a high-tech enterprise, we focus on researching and developing a series of Vacuum soldering system solution and production lines for semiconductor electronic device packaging. We adhere to the core concept of "Innovation&Intelligence&Creativity, &Responsibility" guides us to study domestic and foreign advanced experiences, fully research and development the soldering technology to solve problems of high void rate and hermetic packaging and so on. With more and more customers using our equipment, we getting more high praise from the users.
At the same time, we also established a research and development center with the IGBT industry alliance and various universities and institutes committed to the development of the packaging of power module devices and semiconductor electronic devices. We have achieved a series of accomplishments, including 15 practical patents, software patents, design patents, and currently, more than 25 patents are in the process of being applied for. We will continue to innovate, constantly upgrade our products, increase technology and process development, and strive to become an internationally renowned equipment enterprise.
International Commercial Terms(Incoterms):
FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, FCA
Terms of Payment:
LC, T/T
Average Lead Time:
Peak Season Lead Time: 1-3 months, Off Season Lead Time: one month
Number of Foreign Trading Staff:
4~10 People
Export Year:
2023-03-09
Export Percentage:
21%~30%
Main Markets:
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Nearest Port:
Tianjin
Import & Export Mode:
Have Own Export License
Factory Address:
Address, Tangshan, Hebei, China
R&D Capacity:
OEM, ODM, Own Brand()
No. of R&D Staff:
Above 50 People
No. of Production Lines:
6
Annual Output Value:
US$50 Million - US$100 Million