Shenzhen DOVER Technology Co., Ltd. Was founded in 2004. After more than 20 years of development,

The company focuses on the research and development, production and sales of electronic adhesives,

And has become a leading enterprise of electronic adhesives in China. DOVER Technology (DOVER)

Is a national high-tech enterprise, specialized in special new small and medium-sized enterprises. The

Special background of professional research institute has strong scientific research strength.

The main products are Underfill adhesive/Low temperature curing adhesive/ COB Adhesive/DAM&FILL

Adhesive/UV adhesive/Three proof adhesive/Conductive adhesive/Conductive silver adhesive film/

Thermal conductive adhesive/DIE bonding adhesive/SMT adhesive/Structural adhesive/ sealant, etc.,

Which are used in electronics, medical, photoelectric, communication, automotive, equipment industry

And other industries, at the leading level at home and abroad.

DOVER has established extensive cooperative relations with large domestic and foreign enterprises

Such as BYD/BOE/ Huawei/ ZTE/ Foxconn/ Lenovo/ Wistron/Compal/ Liteon/SCC/TP-Link/SYTECH

And so on. We have won the trust of our customers with high-quality products and fast and comprehensive

After-sales service, and our sales network radiates throughout the country.

DOVER has a standardized and systematic management system, and continuously improves it to meet

Customer needs.

Certified by ISO9001/ISO14001/QC080000/IATF16949.

DOVER Vision: To continue to grow and lead, become an industry leader with high-quality products and

Services, and build the first brand of national electronic adhesives

Quality policy: Stable quality, continuous improvement, rigor, pragmatism, innovation, meeting customer

Needs