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OEM Assembly
US$0.60-1.00 / Piece
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What is Custom Low Power PCB Assembly for Smart Glasses Solutions

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-499 Pieces US$1.00

500-999 Pieces US$0.80

1,000-9,999 Pieces US$0.70

10,000+ Pieces US$0.60

Sepcifications

  • Layers 1-16 Layers
  • Base Material Pi + Fr-4
  • Certification IATF16949/ISO9001:2015/ISO13485/QC08000/ISO45001/
  • Customized Customized
  • Condition New
  • Transport Package Anti-Static Bubble Wrap ESD-Safe Blister Tray
  • Specification 41*40.5*30.5
  • Trademark TDT-ELE
  • Origin Guangdong, China
  • Maximum Dimensions Regular: 234 × 490 mm
  • Minimum Dimensions No Limit
  • Surface Finish Enig. Thickness: 1u" / 2u
  • FPC Thickness Tolerance ±0.05 mm
  • Hole Diameter 0.15-6.5 mm
  • Coverlay Color Yellow / Black / White
  • Pi Stiffener 0.1 mm, 0.15 mm, 0.20 mm, 0.225 mm, 0.25 mm
  • Fr4 Stiffener Thickness Options: 0.1 mm, 0.2 mm

Product Description

Product Description RIGID-FLEX PCBA: PREMIUM HYBRID CIRCUIT BOARD ASSEMBLY FOR HIGH-PERFORMANCE ELECTRONICS Looking for a Rigid-Flex PCBA solution that combines reliability, space efficiency, and superior signal integrity? Our Rigid-Flex PCB Assembly integrates FR-4 rigid sections with ultra-thin ...

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OEM Assembly Comparison
Transaction Info
Price US$0.60-1.00 / Piece US$0.50-100.00 / Piece US$0.50-100.00 / Piece US$0.50-100.00 / Piece US$0.50-100.00 / Piece
Min Order 5 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T T/T T/T T/T T/T
Quality Control
Product Certification IATF16949/ISO9001:2015/ISO13485/QC08000/ISO45001/ RoHS, CCC, ISO, SGS RoHS, CCC, ISO, SGS RoHS, CCC, ISO, SGS RoHS, CCC, ISO, SGS
Management System Certification ISO9001:2015, ISO45001:2018, Others - - - -
Trade Capacity
Export Markets Europe, Domestic - - - -
Annual Export Revenue - - - - -
Business Model ODM, OEM OEM OEM OEM OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Layers: 1-16 Layers;
Base Material: Pi + Fr-4;
Customized: Customized;
Condition: New;
Maximum Dimensions: Regular: 234 × 490 mm;
Minimum Dimensions: No Limit;
Surface Finish: Enig. Thickness: 1u" / 2u;
FPC Thickness Tolerance: ±0.05 mm;
Hole Diameter: 0.15-6.5 mm;
Coverlay Color: Yellow / Black / White;
Pi Stiffener: 0.1 mm, 0.15 mm, 0.20 mm, 0.225 mm, 0.25 mm;
Fr4 Stiffener: Thickness Options: 0.1 mm, 0.2 mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-36layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Turkey Service: PCB/Component Sorcing/SMT/Package;
Factory Capability: 20 Million Chips/Day,600 Million/Month;
Component Size: 01005,LGA,Fine Pitch BGA,Qfn;
Traceability: Full Barcode/Mes System(Component,Batch,Porcess);
Machine Detail: 21 SMT Lines,4 DIP Lines;
Assembly Detail: SMT,Pop,DIP,COB,Flip Chip,SIP;
Inspection: Aoi,Spi,X-ray,Ict&Fct;
Value-Added Service: Bom Analysis,Confirmal Coating,Programming;
Certifications: ISO9001,ISO14001,IATF16949,CSR,Hsf,QC080000;
Material: Complex;
Package: Carton;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-36layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Turkey Service: PCB/Component Sorcing/SMT/Package;
Factory Capability: 20 Million Chips/Day,600 Million/Month;
Component Size: 01005,LGA,Fine Pitch BGA,Qfn;
Traceability: Full Barcode/Mes System(Component,Batch,Porcess);
Machine Detail: 21 SMT Lines,4 DIP Lines;
Assembly Detail: SMT,Pop,DIP,COB,Flip Chip,SIP;
Inspection: Aoi,Spi,X-ray,Ict&Fct;
Value-Added Service: Bom Analysis,Confirmal Coating,Programming;
Certifications: ISO9001,ISO14001,IATF16949,CSR,Hsf,QC080000;
Material: Complex;
Package: Carton;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-36layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Turkey Service: PCB/Component Sorcing/SMT/Package;
Factory Capability: 20 Million Chips/Day,600 Million/Month;
Component Size: 01005,LGA,Fine Pitch BGA,Qfn;
Traceability: Full Barcode/Mes System(Component,Batch,Porcess);
Machine Detail: 21 SMT Lines,4 DIP Lines;
Assembly Detail: SMT,Pop,DIP,COB,Flip Chip,SIP;
Inspection: Aoi,Spi,X-ray,Ict&Fct;
Value-Added Service: Bom Analysis,Confirmal Coating,Programming;
Certifications: ISO9001,ISO14001,IATF16949,CSR,Hsf,QC080000;
Material: Complex;
Package: Carton;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-36layers;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Turkey Service: PCB/Component Sorcing/SMT/Package;
Factory Capability: 20 Million Chips/Day,600 Million/Month;
Component Size: 01005,LGA,Fine Pitch BGA,Qfn;
Traceability: Full Barcode/Mes System(Component,Batch,Porcess);
Machine Detail: 21 SMT Lines,4 DIP Lines;
Assembly Detail: SMT,Pop,DIP,COB,Flip Chip,SIP;
Inspection: Aoi,Spi,X-ray,Ict&Fct;
Value-Added Service: Bom Analysis,Confirmal Coating,Programming;
Certifications: ISO9001,ISO14001,IATF16949,CSR,Hsf,QC080000;
Material: Complex;
Package: Carton;
Supplier Name

Shenzhen Tianditong Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Sunwin Electronic Technology Co., Ltd

Diamond Member Audited Supplier

Shenzhen Sunwin Electronic Technology Co., Ltd

Diamond Member Audited Supplier

Shenzhen Sunwin Electronic Technology Co., Ltd

Diamond Member Audited Supplier

Shenzhen Sunwin Electronic Technology Co., Ltd

Diamond Member Audited Supplier