Mrs. Sissy Qin
Address:
Gonghe Zhiying Pcb Industrial Park, Sha Jing Rd, Shenzhen, Guangdong, China
Telephone:
Zip Code:
Fax:
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Account Registered in:
2018
Business Range:
Auto, Motorcycle Parts & Accessories, Computer Products, Consumer Electronics, Electrical & Electronics, Health & Medicine, Industrial Equipment & Components, Lights & Lighting, Manufacturing & Processing Machinery, Security & Protection, Toys
Management System Certification:
ISO 9000
Business Type:
Manufacturer/Factory
Company Introduction
Production Capacity
Golden faith PCB Co., Ltd., is a based manufacturer of High Density Interconnect PCBs (HDI PCBs). Our HDI capabilities include laser microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad technology. We have provided microelectronic pcbs with fine pitch devices down to 200 microns, using 50 micron laser drilled via-in-pad technology and thin build-up materials. ...
Golden faith PCB Co., Ltd., is a based manufacturer of High Density Interconnect PCBs (HDI PCBs). Our HDI capabilities include laser microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad technology. We have provided microelectronic pcbs with fine pitch devices down to 200 microns, using 50 micron laser drilled via-in-pad technology and thin build-up materials. Upload your data and receive a free consultation and review of your HDI design today or contact us if you need any design help. Experience our expertise and feel the difference.
The HDI PCBs we offer include the following highly requested characteristics:
Blind and/or buried vias
Via-in-pad
Through vias from surface to surface
20 μm circuit geometries
30 μm dielectric layers
50 μm laser vias
125 μm bump pitch processing
Our high density circuit boards have the technology-pushing capabilities to drive applications in a large number of industries including but not limited to
Semiconductor test equipment, defense, medical and aerospace.
The HDI PCBs we offer include the following highly requested characteristics:
Blind and/or buried vias
Via-in-pad
Through vias from surface to surface
20 μm circuit geometries
30 μm dielectric layers
50 μm laser vias
125 μm bump pitch processing
Our high density circuit boards have the technology-pushing capabilities to drive applications in a large number of industries including but not limited to
Semiconductor test equipment, defense, medical and aerospace.
Factory Address:
Gonghe Zhiying Pcb Industrial Park, Sha Jing Rd, Shenzhen, Guangdong, China
