Huizhou xinci ceramic semiconductor Co., Ltd. is a manufacturer of DPC ceramic substrates and packaging devices with leading R & D and manufacturing technology. The company was founded in 2020 and is a member of Huanyu enterprise group.

Core ceramic semiconductor is the first manufacturer in China to develop DPC process ceramic substrate, and is also the inventor of 3D dam enclosure products. In addition to advanced R & D capabilities, it also has the advantage of large-scale production. At present, the monthly production capacity is more than 100000 pieces.

The company has a self-trained professional technology R & D team, advanced ceramic production equipment and management system, and strict quality control process, which can efficiently and stably provide customers with high-quality ceramic circuit boards that meet the R & D process and production needs.

At present, the company has obtained more than 60 invention patents, and has successively obtained ISO14001 environmental management system certification and ISO9001 quality management system certification.

The company has always taken "zero quality defects" as the goal, regarded product quality as the lifeline of the enterprise, and "customer first" as the service concept to provide high-quality and reliable products and services for customers

Domestic customers mainly include Huawei, oufeiguang, Jingneng semiconductor, San'an optoelectronics, Hongli Zhihui, Ruifeng optoelectronics, military research institute, etc. Foreign customers include Seoul semiconductor, Kyocera, etc. The 3D forming DPC ceramic substrate products independently developed by the company are highly praised by domestic and foreign customers.